Written by Carlos Saca and Carlos Saca Jr.
There are many ways to solder and unsolder the boards of iPhone Series X and 11. In this blog, we will mention those we know that are more effective:
- Using simply the heat gun and tweezers: this method might not need additional tools to those we already have in our microelectronics workshops, but it requires a lot of expertise on from the technician, and since he only has one free hand (because you must hold the heat gun with one of your hands), even if you are an expert, you can sometimes make, at best, some time-consuming mistakes.
- Using a preheater and holder to hold the board while you resold it: This technique consists in heating the board to unsolder and re-solder it. A holder is placed while the board is reheating. In this procedure, once the board has been attached and the preheater has been turned off, the board is usually left on the preheater with the holder on it until it's completely cool. This technique, although effective, causes the board to receive heat for too much time.
- Here is our favorite method and, in our humble opinion, the simplest of all: it consists in using a preheater, tweezers and a cutter. First, place the board on the preheater, wait a few minutes, and remove the upper layer using the cutter and tweezers. Immediately, you have to remove the board so it doesn't get overheated. Afterwards, remove the internal resin and check that the connection pads are the same size, since sometimes some connection pads stretch (especially the ground connection pads). If so, you can cut them with the cutter. Subsequently, place a bit of flux around the entire board, place the upper layer very well aligned, wait a few minutes... and that's it. You'll only use the preheater.
In this case, for its efficiency and simplicity, we recommend the Qianli Mega Idea Pre-Heater, available for the iPhone X, Xs, Xs Max, 11, 11 Pro and 11 Pro Max models.
You can also find many other products on 4phones.eu.